Fabless chip maker MediaTek today formally launched its much-talked-of Dimensity 9000 5G smartphone chipset. This new chipset rivals the Snapdragon 8 Gen 1 and is expected to power top of the line Android devices the next year.

The Dimensity 9000, which is built on the TMSC N4 (4nm-class) production process, is expected to enhance computing performance, gaming, imaging, multimedia and connectivity innovations in phones.

Announcing the availability of the chipset, Dr Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, said “the Dimensity 9000 is the most powerful and energy-efficient chip to date, delivering a number of industry firsts and a full suite of features for the most discerning tech enthusiasts.” [1]

Figure 1. MediaTek Officially Launches Dimensity 9000 Flagship Chip

Figure 1 shows The flagship SoC was initially announced in November. It is fabricated using TSMC's 4nm process and integrates a 10-core Arm Mali-G710 MC10 GPU and MediaTek APU 590. It integrates Armv9 architecture with one Arm Cortex-X2 CPU clocking at up to 3.05GHz, three Arm Cortex-A710 CPUs with a maximum clocking speed of 2.85GHz, and four ARM Cortex-A510 CPUs. It support LPDDR5x RAM with up to 7,500Mbps speeds. [3]

Key features of MediaTek Dimensity 9000 include:

• MediaTek Imagiq 790: The chipset’s flagship 18-bit HDR-ISP. The world’s first to support 320MP on smartphones, and the world’s first to support simultaneous triple camera 18-bit HDR video recording. The powerful 9Gpixel/s ISP also supports 4K HDR Video + AI noise reduction that enables the highest quality results even in extreme low-light scenarios.
• Leading 3GPP Release-16 5G Modem: The integrated 5G modem amplifies sub-6GHz performance up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz). It also features the world’s 1st R16 UL enhancement and continues MediaTek’s dual SIM leadership with new 5G/4G Dual SIM Dual Active support. The modem also integrates the new MediaTek 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
• MediaTek MiraVision 790: The chipset can support the latest 144Hz WQHD+ displays or super-fast 180Hz Full HD+ displays, while optimizing power efficiency with MediaTek’s Intelligent Display Sync 2.0 technology. Furthermore, MediaTek’s latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
• Wi-Fi 6E, New GNSS with Beidou III-B1C and New Bluetooth 5.3: Smartphone users can enjoy seamless connectivity thanks to the chipset’s support for the latest Wi-Fi, Bluetooth and GNSS standards.
• Dimensity 5G Open Resource Architecture: The Dimensity 9000 allows the world’s leading smartphone device makers to create customized flagship 5G smartphones that stand out. [2]

References:

1. https://www.techradar.com/in/news/upcoming-flagship-smartphones-with-dimensity-9000-soc
2. https://www.electronicsforu.com/news/press-releases/mediatek-officially-launches-dimensity-9000-flagship-chip
3. https://gadgets.ndtv.com/mobiles/news/mediatek-dimensity-9000-5g-soc-launch-honor-oppo-vivo-xiaomi-2022-tsmc-2654653

Cite this article:

Thanusri swetha J (2021) MediaTek Officially Launches Dimensity 9000 Flagship Chip, AnaTechmaz, pp. 40